Connect with:
Reference: BIADEA025A
Reference: CPIPH12PMRPF
Reference: LXMI11TFNSP
Reference: FXIPH7THW5GN
Security policy
(edit with the Customer Reassurance module)
Return policy
(edit with the Customer Reassurance module)
Mechanic 3D BGA reballing stencil groove, Nuovo modello di scheda madre Reballing Stencil BGA 3D di livello medio brevettato per iPhone X,
Foro quadrato laser 3D
Utilizzato per aiutare i professionisti a eseguire il reballing di iPhone X BGA nel modo più comodo e sicuro.
Data sheet
Reference: DIPH11BGA
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